• US Citizen

• Green Card

• EAD (OPT/CPT/GC/H4)

• H1B Work Permit

• Corp-Corp

• W2-Permanent

• W2-Contract

• Contract to Hire

• Consulting/Contract

• UG :- - Not Required

• PG :- - Not Required

• No of position :- ( 1 )

• Post :- 29th Mar 2024

1.       Background:  The job involves the use of in-FAB tooling and equipment to help fabricate advanced semiconductor devices on 200mm silicon wafers in the FAB.  The work is conducted in a cleanroom environment and a basic knowledge of the principles behind semiconductor processing, chemistry and physics is required.  In addition, strong computer and analytical skills are necessary and experience in semiconductor processing is a plus.  The candidate is expected to work closely with engineers and the research teams to accomplish the tasks assigned to him/her.  The work is centered around IBM’s most advanced R&D efforts at its premier research and development site.  Good communication skills and the ability to handle fast-paced, complex work is essential.  The position is for a reactive ion (RIE) technician/engineer.  Candidate should have familiarity with the basic knowledge of RIE fundamentals, tool operation and basic plasma chemistry knowledge.

2.       The World is Our Laboratory: No matter where discovery takes place, IBM researchers push the boundaries of science, technology and business to make the world work better. IBM Research is a global community of forward-thinkers working towards a common goal: progress.

·       Job Duty 1 – Processing wafers: Developing processes and characterization of wafers on reactive ion etch platform tools.

·       Job Duty 2 – Prior chemical / compressed gas use required

·       Job Duty 3 –Shift opening is from 3PM to 12AM or 6AM to 3PM

·       Job Duty 4 - Ability to learn fast, execute with minimal errors, document with details, and communicate with clarity.

·       English: fluent

·       Job Duty 5 – Operate reactive ion etch tools